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Lesson 8: Troubleshooting (Cracks, Chips, Thickness, Service Recovery)

NT204-M04-L03

M04-L03

60

Intermediate

By the end of this lesson, students will be able to:

  • [ ]  Troubleshoot cracks, chips, and thickness issues.

  • [ ]  Identify root causes (prep, layers, activator, filing).

  • [ ]  Use a service recovery plan (repair vs remove).

  • [ ]  Document fixes for next appointment.

Troubleshooting (dip powder)

1) Common issues + causes

  • cracks: weak apex or impact

  • chips: edge not capped, thin top coat

  • thickness: heavy layers, poor refinement

2) Luxury standard

Luxury troubleshooting is calm, clear, and solution-focused.

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MASTER

Completion:

  • [ ]  Theory Complete

  • [ ]  Workbook Complete

  • [ ]  Practical Complete

  • [ ]  Assessment Passed

  • [ ]  Instructor Approved

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